SUBMIT AN ABSTRACT

Submit Abstract

Abstract submission for the 2017 ITCC conference is now closed. If you would like an abstract to be considered for late acceptance, please email the abstract to mikaela.imbriani@usu.edu.

Please see below for topic ideas and research to be presented at the conference.

Conference Organizing Committee
Prof. Heng Ban, Conference Chair
Angie Griffeth, Conference Coordinator


Papers accepted and presented at the Conference and Symposium will be published after a rigorous peer review. Visit our PUBLICATION tab on the website for more information on how to submit your paper for publication. If you have any questions please contact Angie Griffeth.

Each abstract submitted will require:

  • Abstract Title
  • Type (Poster or Oral presentation)
  • 250 word description

Presenter Information:

  • First and Last Name
  • Email address for notifications
  • Person type – POC (Point of Contact) Primary Presenter, Author, & Co-Author (Mark all that apply)
  • Main Phone
  • Employment Title
  • Affiliation

Topics

Materials
  • Graphene
  • Nano materials
  • Graphite
  • Polymers
  • Biomaterials
  • Foods
  • Metals
  • Iron and alloys
  • Ceramics
  • Coatings and barrier materials
  • Geological materials, testing techniques, mixtures, effect of pressure, in-situ testing
  • Thermal insulators
  • Adhesives
  • Thermoelectric materials
  • Thermal interface materials and measuring techniques, data
Industrial applications
  • Aluminum industry related topics
  • Ceramic industry related topics
  • Semiconductors and thermoelectric materials
  • Powders
  • Foams
  • Innovative insulations
  • Vacuum insulation
  • Aerogels
  • Microporous materials
  • Phase-change materials (PCM)
  • Thermal expansion of composites, pastes, multiphase mixtures, liquids, solids, molten metals
  • Sintering and HIP
  • Additive manufacturing, 3D printing
Fluids
  • Liquids: liquid mixtures, etc. theory/new methods/data/progress
  • Gases: theory/new methods/data/progress
  • Molten metals: theory/new methods/data/progress
  • Molten ceramic and semiconductor materials
  • High pressure testing
Review Papers
  • General methods and techniques
  • New methods and techniques
  • New advances
  • Transient techniques
  • Steady-state techniques
  • Absolute techniques
  • Comparative techniques
  • History of thermophysical measurements
Commercially made Instruments/data/analysis
  • Dilatometers
  • Thermal conductivity measuring instruments
  • Thermal diffusivity instruments
  • New commercially introduced instruments
Properties at different length scales
  • Thermal conductivity
  • Thermal diffusivity
  • Thermal effusivity
  • Electrical resistivity
  • Specific heat capacity
  • Seeback coefficient
  • Emissivity
  • Apparent properties and their use
General theory, modeling and simulation, data management
  • Molecular dynamics
  • Mesoscale (phase field) modeling
  • Thermal modeling
  • Multiscale modeling
  • Data analysis, organization, data bases
  • Estimation techniques
  • Theory development
  • Multi-layer analysis theory/new methods/data/progress
  • Radiative heat transfer, effect on thermal conductivity measurement techniques and data
Measurement methods and techniques
  • Thermal conductivity
  • Thermal diffusivity
  • Thermal effusivity
  • Thermal reflectance methods
  • 3-Omega and hot wire
  • Dilatometry
  • Interferometry
  • Noncontact dilatometry
  • Flash diffusivity
  • Calorimetry
  • Subsecond methods (Ohmic pulse, exploding wire, etc.)
  • New measurement techniques and equipment
  • Interface thermal resistance
  • Thin films
  • Cryogenic /near ambient/
  • High temperature /ultra-high temperature techniques
  • Hot plate apparatus
Space and Nuclear applications
  • Space applications/satellites/ micro gravity techniques and data
  • Thermal expansion of solids, liquids and gases
  • Thermal radiative properties, measurement techniques and data (emissivity, etc.)
  • Special applications, testing of complex systems
  • Nuclear materials, special techniques, in-pile testing, special applications
  • Irradiation effect on thermal properties
Thermal expansion testing/data/equipment
  • Review paper on techniques, new developments
  • Review paper on interferometers in dilatometry
  • Optical and other noncontact dilatometry
  • Ultra-high temperature dilatometry
Standards
  • General treatise
  • Current state US and international
  • In progress, developments, programs
  • Reference material development
  • Inter-laboratory comparisons
  • Method comparison

Abstract submission for the 2017 ITCC conference is now closed. If you would like an abstract to be considered for late acceptance, please email the abstract to mikaela.imbriani@usu.edu.

After your abstract has been submitted there will be a review process. You will be notified by email of your acceptance by the first part of February 2017.

After your paper has been accepted please make sure you register for the conference.






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