ITCC/ITES 2014 at Purdue University

History and awards

ITCC / ITES History

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View the Awards from past conferences

International Thermal Conductivity Conference (ITCC)

Conference Year Host Chairman
1st 1961 Battelle Memorial Institute, Columbus, OH C.F. Lucks
2nd 1962 National Research Council, Ottawa, Canada M.J. Laubitz
3rd 1963 Oak Ridge National Laboratory, Gatlinburg, TN D.L. McElroy
4th 1964 US Naval Radiological Defense Lab,
San Francisco, CA
R.L. Rudkin
5th 1965 University of Denver, Denver, CO J. D. Plunkett
6th 1966 Air Force Materials Lab (WPAFB) Dayton, OH M.L. Minges
G.L. Denman
7th 1967 National Bureau of Standards, Gaithersburg, MD D.R. Flynn
B.A. Peavy
8th 1968 Thermophysical Properties Research Laboratory Purdue University, West Lafayette, IN C.Y. Ho
R.E. Taylor
9th 1969 Ames Lab & Office of Naval Research, Ames, IA H.R. Shanks
10th 1970 Arthur D. Little Inc.& Dynatech R/D Co. Boston, MA R.W. Powell
11th 1971 Sandia National Laboratory, Los Alamos Scientific University of New Mexico, Albuquerque, NM R.U. Acton
P. Wagner
12th 1972 Southern Research Institute, University of Alabama, Birmingham, AL W.T. Engelke
S.G. Bapat
M. Crawford
13th 1973 University of Missouri-Rolla, Lake of the Ozarks, MO R.L. Reisbig
H.J. Sauer, Jr
14th 1975 University of Connecticut, Storrs, CT P.G. Klemens
15th 1977 Department of Energy, Mines & Resources, Ottawa, Canada V.V. Mirkovich
16th 1979 IIT Research Institute, Chicago, IL D.C. Larson
17th 1981 National Bureau of Standards, Gaithersburg, MD J.G. Hust
18th 1983 South Dakota School of Mines, Rapid City, SD T. Ashworth
19th 1985 Tennessee Technological University, Cookville,TN D.W. Yarbrough
20th 1987 Virginia Polytechnic Institute, Blacksburg, VA D.P.H. Hasselman
J.R. Thomas, Jr.
21st 1989 University of Kentucky, Lexington, KY C.J. Cremers
H.A. Fine
22nd 1993 Arizona State University, Tempe AZ T. Tong
23rd 1995 Oak Ridge National Laboratory, Nashville, TN R.B. Dinwiddie
R.S. Graves
K.E. Wilkes
24th 1997 Anter Corporation, Pittsburgh, PA P.S. Gaal
D. E. Stroe
25th 1999 University of Michigan, Ann Arbor, MI C. Uher
D. Morelli
26th 2001 Holometrix, Inc., Cambridge MA S. Smith
R. Mannello
27th 2003 High Temperature Materials Laboratory at Oak Ridge National Laboratory, Knoxville, TN H. Wang
W. Porter
28th 2005 St. Andrews by-the-Sea, New Brunswick, Canada K. Schmidt
N. Mathis
29th 2007 Southern Research Institute and
University of Alabama, Birmingham AL
J. Koenig
H. Ban
30th 2009 Anter Corporation, Pittsburgh, PA D.S. Gaal
P.S Gaal


International Thermal Expansion Symposia (ITES)

Conference Year Host Chairman
1st 1968 National Bureau of Standards, Washington DC
Westinghouse Astronuclear Laboratory
R.K. Kirby
P.S. Gaal
2nd 1970 Sadia National Laboratory, Santa Fe, NM
University of Illinois
D.C. Wallace
R.O. Simmons
3rd 1971 Corning Glass Works, Corning, NY
University of Toronto
H.E. Hagy
G.M. Graham
4th 1973 TPRL (Purdue), Lake of the Ozarks, MO
Air Force Material Laboratory (WPAFB)
R.E. Taylor
G.L. Denman
5th 1975 University of Connecticut, Storrs, CT
Oak Ridge National Laboratory
P.G. Klemens
T.G. Gogfrey
6th 1977 Atomic Energy of Canada, Whiteshell
Hecla Island, Canada
I.D. Peggs
7th 1979 IIT Research Institute, Chicago, IL
Tepiac/CINDAS
D.C. Larson
8th 1981 National Bureau of Standards, Gaithersburg, MD T.H. Hahn
A. A. Cezairliyan
9th 1986 Anter Laboratories, Inc. Pittsburgh, PA P.S. Gaal
10th 1992 National Institute of Standards & Technology Boulder, CO L. Sparks
11th 1995 Ceramics Industries, Congress and Exhibit Pittsburgh, PA P.S. Gaal
12th 1997 Anter Corporation, Pittsburgh, PA P.S. Gaal
E.P. Hurst, II
13th 1999 University of Michigan, Ann Arbor, MI C. Uher
D. Morelli
14th 2001 Holometrix, Inc., Cambridge MA S. Smith
R. Mannello
15th 2003 High Temperature Materials Laboratory at Oak Ridge National Laboratory, Knoxville, TN H. Wang
W. Porter
16th 2005 St. Andrews by-the-Sea, New Brunswick, Canada K. Schmidt
N. Mathis
17th 2007 Southern Research Institute and
University of Alabama, Birmingham AL
J. Koenig
H. Ban
18th 2009 Anter Corporation, Pittsburgh, PA D.S. Gaal
P.S. Gaal

The 30th International Thermal Conductivity Conference (ITCC) and the 18th International Thermal Expansion Symposium (ITES) were hosted by Anter Corporation in Pittsburgh, Pennsylvania on August 29 – September 2, 2009. The conference chairmen were Daniela S. Gaal and Peter S Gaal.

Over 150 registered delegates attended this four-day program, consisting of 124 presentations with 246 authors and two workshops. With nearly the half of the attendees from Europe and Asia, the Conference had lived up to the "international" name. Additional to the presentations, three committee meetings of international organizations also took place.

At this Conference, the Board of Governors voted to enlarge its membership with three invited, worldwide recognized colleagues, Drs Tetsuya Baba (AIST, Japan), Ulf Hammerschmidt (PTB, Germany) and Robert Zarr (MIST, USA). Additionally, Dr. László I. Kiss from University of Quebec at Chicoutimi, Canada, became a member of Board, being the chairman of the next Conference, to be held in Chicoutimi, Canada, in 2011. The Board of Governors accepted with regret the resignation of Dr. Dick Hasselman, who had been a member of the Board for many years and had served even as its Chairman for a period.

This year’s Conference honoured Alp Sehirlioglu (NASA Glenn Research Center, USA) as an outstanding young researcher in the field with the Lucks Award. The selection by the Board was made sometimes in the spring, affording Dr Sehirlioglu time to prepare his Invited Lecture and deliver it at the Conference, upon receiving the Award.

Honouring outstanding colleagues who had contributed to the growth of the field of thermophysics, the Board bestowed the title of Fellow of the ITCC upon Therese Stovall (Oak Ridge National Laboratory, USA) and Andrzej Brzezinski (Lasercomp. Inc., USA).

The prestigious Thermal Conductivity Award was presented to Drs. William J. Parker (NIST, USA, retired) and David Salmon (NPL, United Kingdom, retired) for their lifelong work and outstanding contributions in this field. The Thermal Conductivity Award is a traveling trophy, kept in possession by each recipient until the next Conference.

The web site will be updated frequently as more information becomes available. Please check back often for updates.