Due to the Covid pandemic, the ITCC board has decided to postpone the event until March 20, 2022!
35th International Thermal Conductivity Conference (ITCC)
23rd International Thermal Expansion Symposium (ITES)
Sunday, March 20 – Wednesday, March 23, 2022
Hosted by NETZSCH Instruments NA
The ITCC ITES team proudly presents a world class lineup of plenary speakers for the 2022 Conference
Welcome to the official web site of the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). These two conferences are held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics.
The ITCC ITES Conference is the best place to network with world leaders in the fields of thermal conductivity and thermal expansion. Attending this specially timed event means living and breathing your science with intimate access to the best minds in the field. Talks, breaks, dinners, the awards banquet. All geared for constructive interaction and discussion. Come meet the greatest minds in your field and become part of the history of the ITCC ITES.
We encourage you to submit an abstract and present at this conference. This premier conference series has a long history, and has served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development. This conference will feature thermal conductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications.
- Early-bird Registration Deadline: November 30th , 2021
- Regular Registration Deadline: February 20th , 2022
- Final Abstract Submission: November 30th, 2021
- Notification of Abstract Acceptance: December 15th, 2021