34th International Thermal
Conductivity Conference (ITCC)

22nd International Thermal
Expansion Symposium (ITES)

Monday, June 17 – Thursday, June 20, 2019 Hosted by TA Instruments

Hotel du Pont – Wilmington, Delaware, USA

Welcome to the official web site of the International Thermal Conductivity Conference (ITCC) and the International Thermal Expansion Symposium (ITES). These two conferences are held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings are published in hard cover format following the conference and a rigorous peer review.

We encourage you to submit an abstract and present at this conference. This premier conference series has a long history, and has served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development. This conference will feature thermal conductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications.

Important Dates

  • Open Now – Submit Your Abstract Today!
  • Early-bird Registration is Open — Register Now
  • Abstract Submission Deadline: December 15th, 2018
  • Notification of Acceptance: February 28th, 2019
  • Early-bird Registration Deadline: March 9th, 2019
  • Regular Registration Deadline: May 17th, 2019
  • Conference dates: June 17th through June 20th, 2019

Topics/Subtopics

  • Advanced ceramics
  • Fast Firing of traditional ceramics
  • Graphene
  • Vacuum Insulation Panels (VIP)
  • Aerogels
  • Phase-change materials (PCM)
  • Thermal properties and electronic devices
  • Additive manufacturing, 3D printing
  • Coatings and barrier materials
  • Quenching and deformation of steel and alloys
  • Thermal conductivity
  • Thermal diffusivity
  • Dilatometry
  • Non-contact dilatometry

See Topic Details >>

Looking forward to seeing you there.

Register now! Submit PaperSee list of Topics