ITCC Abstract Submission
The ITCC ITES Conference is the best place to network with world leaders in the fields of thermal conductivity and thermal expansion. Attending this specially timed event means living and breathing your science with intimate access to the best minds in the field. Talks, breaks, dinners, the awards banquet. All geared for constructive interaction and discussion. Come meet the greatest minds in your field and become part of the history of the ITCC ITES.
We encourage you to submit an abstract and present at this conference. This premier conference series has a long history, and has served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development. This conference will feature thermal conductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications.
- Early-bird Registration Deadline: July 31st , 2022
- Regular Registration Deadline: August 20th , 2022
- Final Abstract Submission: 1st September, 2022
- Notification of Abstract Acceptance: 5th September, 2022