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International Thermal Conductivity Conference (ITCC) and International Thermal Expansion Symposium (ITES) are two conferences held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings will be published in hard cover format following the conference and a rigorous peer review.

These premier conferences have a 58 years long history, since 1961 they have served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development on thermophysics. The conference will feature thermal  onductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications.

To submit an abstract for a session talk, fill out the Abstract Submission Form and attach a digital copy of your abstract.  The abstract submission can also be sent directly via email to Jason Saienga (  An example abstract can be found here.  Invite your contacts and collaborators to present, too.  Any other questions about the process should direct to Jason as well.

Abstract Submission Deadline: February 22nd, 2019

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Looking forward to seeing you there.

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