International Thermal Conductivity Conference (ITCC) and International Thermal Expansion Symposium (ITES) are two conferences held concurrently every two years. Our mission is to provide a forum for the free exchange of ideas, advancement of the science, training of new professionals, and discussions of the state-of-the-art in thermophysics. The proceedings will be published in hard cover format following the conference and a rigorous peer review.
These premier conferences have a 58 years long history, since 1961 they have served as an excellent forum for engineers, researchers, and program/project managers from industry, academia, and government labs to exchange and share the latest results in research and development on thermophysics. The conference will feature thermal onductivity and thermal expansion topics, as well as all thermophysical properties for materials, techniques, and applications.
We are currently working on the last details of the paper submission process and will soon send out the official call for papers. Please send an email to firstname.lastname@example.org, so that we could inform you about the progress.
Registration & Abstract Submission Form